France-based Smart Packaging Solutions (SPS) has contracted Malaysian ID security provider IRIS to supply high-security IC modules for the production of a new generation of smart cards in a deal valued at 8 million euros.
Under the terms of the contract IRIS will supply the modules over a 36-month period. The company says it will produce these new modules using the next generation of module assembly technologies developed by SPS.
“This collaboration with SPS represents a major step forward for IRIS into the new generation of smart card technologies,” says Dato’ Tan Say Jim, managing director of IRIS. “While the focus in the industry has been primarily on the development of new IC chips with more capacity and higher security features, the time has come for the smart card packaging and production technologies to complement the entire production process and produce smart card products with enhanced features. SPS is a leading-edge developer of new packaging and production technologies for IC module assembly and this collaboration augurs well for IRIS where one of our core expertise is in the manufacturing of complete smart cards.”