KSW launches Thinlam

 

KSW Microtec has launched Thinlam, a contactless prelaminate for RFID card and government applications.

The Thinlam is 280 µm thick and enables manufacturers to produce HF and UHF RFID cards with more layers. According to KSW, this extends the opportunities of integrating more security and other high value features into cards. It says: “The exceptional thinness is achieved by manufacturing the Thinlam without chip modules which also results in smoother card surfaces and better printing outcome.

The company claims Thinlam maintains high levels of durability because of a patented chip connection technology. It adds: “Due to the consistently reproducible antenna geometries, Thinlam achieves tighter resonance frequency tolerances.”

Thinlam can be manufactured on PVC, polycarbonate, PET or Teslin and can also be used for transparent RFID cards because of its optical characteristics.